Classification by diamond particle type
Single crystal diamond suspension
Characteristics: Made from broken single diamond crystals, the particles are irregular polyhedra with sharp edges and strong cutting force.
Preparation process: Prepared by physical methods such as mechanical crushing, high-pressure water jet, or laser cutting.
Applicable scenarios: Suitable for rough polishing and medium precision grinding and polishing, such as preliminary processing of metal materials and ceramics.
Polycrystalline diamond suspension
Characteristics: Composed of multiple diamond microcrystals, the particle surface is rough and multi edged. When broken, it can self sharpen into new cutting edges, with high grinding efficiency and good surface quality.
Preparation process: polycrystalline diamond powder is synthesized by chemical vapor deposition (CVD) or sol-gel method, and then dispersed in the carrier.
Applicable scenarios: Suitable for precision polishing and high-precision processing, such as final polishing of semiconductor chips and optical glass.

Classified by carrier type
Water based diamond suspension
Features: Using water as the dispersing medium, adding surfactants and stabilizers, environmentally friendly and easy to clean, but prone to bacterial growth.
Applicable scenarios: Suitable for environments with high environmental requirements, such as laboratory metallographic sampling and medical device polishing.
Oil based diamond suspension
Characteristics: Using mineral oil or synthetic oil as the carrier, it has good lubricity and can reduce processing heat damage, but it is difficult to clean.
Applicable scenarios: Suitable for high temperature or high load processing, such as grinding of hard alloys and high-temperature alloys.
Organic solvent fund diamond suspension
Characteristics: Using organic solvents such as alcohols and esters as carriers, with low volatility and good dispersion stability, but safety precautions should be taken.
Applicable scenarios: Suitable for polishing precision optical components and semiconductor chips.

Classified by particle size
Coarse particle suspension (>10 μ m)
Features: Strong cutting force, high material removal rate, but high surface roughness.
Applicable scenarios: Suitable for rough grinding and rapid shaping, such as preliminary processing of metal billets.
Medium sized suspension (1-10 μ m)
Features: Balancing cutting force and surface quality, suitable for semi precision machining.
Applicable scenarios: intermediate grinding steps for ceramics and glass.
Fine particle suspension (0.1-1 μ m)
Characteristics: Weak cutting force, but can significantly reduce surface roughness and achieve mirror effect.
Applicable scenarios: Suitable for precision polishing and ultra precision machining, such as final polishing of semiconductor chips and optical lenses.
Nanoscale suspension (<0.1 μ m)
Features: Fine particles, capable of repairing micro defects, and obtaining a super smooth surface.
Applicable scenarios: such as polishing high-precision optical components and quantum devices.

Classified by functional characteristics
Universal suspension
Features: Wide particle size distribution, suitable for various processing needs, high cost-effectiveness.
Applicable scenarios: Suitable for grinding and polishing with general precision requirements.
High concentration suspension
Characteristics: High diamond particle content (>10%), high cutting efficiency, but attention should be paid to dispersion stability.
Applicable scenarios: Suitable for large margin machining or production.
Low concentration suspension
Features: Low particle content (<5%), suitable for precision polishing or thin layer material processing.
Applicable scenarios: such as surface treatment of thin film materials and coatings.
Customized suspension
Features: Adjust particle size, concentration, carrier or add special ingredients (such as rust inhibitors, lubricants) according to user needs.
Applicable scenarios: Suitable for special materials or process requirements, such as polishing difficult to process metals and composite materials.

Classified by application field
Semiconductor specific suspension
Features: Fine particle size (<0.5 μ m), high purity, avoiding metal contamination.
Applicable scenarios: Polishing of semiconductor chips such as silicon, silicon carbide, gallium nitride, etc.
Optical specialized suspension
Features: Good dispersion stability, able to achieve ultra-low roughness surface.
Applicable scenarios: Polishing of optical components such as lenses, prisms, and fiber optic connectors.
Metal processing special suspension
Features: Contains lubricants and rust inhibitors, suitable for the characteristics of metal materials.
Applicable scenarios: Grinding and polishing of metals such as stainless steel, aluminum alloy, and titanium alloy.
Ceramic processing special suspension
Features: Strong cutting force, capable of processing high hardness ceramics.
Applicable scenarios: Polishing of ceramics such as zirconia and silicon nitride.