Resin materials:
Epoxy resin: It features excellent physical adsorption capacity and low shrinkage rate. It can penetrate into voids and cracks of specimens, and is suitable for porous materials, samples requiring edge protection, vacuum impregnation and other applications. Epoxy resin generally consists of two components: Part A (resin) and Part B (hardener), which shall be mixed in a specified ratio before use.
Acrylic resin: It offers a short curing time, ideal for batch mounting of irregularly shaped specimens. It presents favorable permeability for samples with cracks or pores, and is especially suitable for potting of printed circuit boards. Acrylic resin is also composed of resin and hardener.
Light-curing resin: It delivers an ultra-fast curing process and can be fully cured within minutes, making it suitable for rapid sample preparation, such as high-speed mounting in the microelectronics industry. Containing photoinitiator, light-curing resin can harden rapidly under ultraviolet irradiation.
Auxiliary materials:
Mold release agent: Applied to the inner wall of molds to facilitate demolding and prevent adhesion between mounting blocks and molds. Common options include silicone oil, petrolatum and other alternatives.
Pigment (optional): Used to tint mounting blocks for distinguishing different samples or meeting specific observation needs. The selected pigment shall be compatible with resin materials without affecting the curing performance.
Filler (optional): Quartz powder, glass beads and other fillers are commonly used to adjust the fluidity, hardness and wear resistance of resins, so as to meet the requirements of specialized application scenarios.